| Work Size: |
ψ50mm~150mm wafer Max. □150mm x 150mm substrate |
| Spin Speed: | 100 ~ 4500 rpm |
| Spin Speed Accuracy: | ±1% |
| Acceleration: | 3000rpm / Sec. |
| Developer Nozzle: | 1 ~ 3 System |
| DIW Nozzle: | 1 System |
| Back Side Rinse: | Yes |
| Recipe: | 20 Recipes x 40 Steps |
| Work Fixture: | By Vacuum |
| Stage Material: |
Al Option : Teflon |
| System Control: | PLC |
| Option: |
Developer Temp. Control System N2 Dry nozzle |