Mask Aligner

ELS108SA

觀看設備規格:

  • ELS108SA
Work Size: ψ150mm ~ 200mm wafer or 
Max. 200mm x 200 mm substrate
Mask Size: 7" or 9" Quartz or Soda Lime 
Lamp House Watt 660W~940W
Wavelength Range Broad Band
( i line : 365nm /
 h line : 400nm / g line : 436 nm )
Light Intensity > 20 mW / cmbased on 365 nm
Lamp Source UV Mercury Lamp
Light Intensity Uniformity < 3%  based on Dia. 8" wafer
Effective Exposure Area Max. 200 mm x 200 mm 
Compensation Leveling System Driven By Auto
Contact Driven By Auto
Exposure Mode Proximity / Soft Contact / Hard Contact /
Vacuum Contact
Alignment System By CCD driven by manual method
Alignment Accuracy ±1μm
L/S Resolution 1μm based on contact mode and PR thickness 1μm
Anti-vibration Table Yes
System Control PC Base
Option Cut Filter
DUV Lamp House

Chuck for Broken wafer
積算光量功能
Power Meter
Bottom Side Alignment System

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