| Wafer Size: | 200mm ~ 300mm wafer |
| Layout Unit: |
Auto Load port / Robot + Track / Centering / Coater / HP / CP / ULD |
| Robot Type: | Double arms with mapping system |
| Clean Class: | Class 100 with HEPA |
| Spin Speed: | 30 ~ 5000 rpm |
| Acceleration: | 8000 rpm / sec. |
| PR Dispense Method: |
N2 Pressure Tank or Pump (Option: PR Pump for High Viscosity up to 10,000 cps) |
| Edge / Back Side Rinse: | YES |
| HP Temp: | 30 ~ 200°C |
| Heating Method: | Contact / Proximity |
| System Control: | PC Base (Option : SECS + GEM available ) |
| PLC Sequencer: | Mitsubishi Q series |
| Recipe: | 30 recipes x 50 steps |
| Throughput / hr: | Up to 50pcs based on Thick PR recipe |