Auto Hot Plate
ELS606FA
觀看設備規格：
- ELS606FA
| Wafer Size | 100mm ~ 150mm wafer |
| Layout Unit | LD / Robot / Centering / HP / ULD |
| Robot Type | Double arms with mapping system |
| Clean Class | Class 100 with HEPA |
| HP Temp. | 30 ~ 150°C (Option : max. 200°C) |
| Heating Method | Contact / Proximity |
| System Control | PC Base (Option : CIM function) |
| PLC Sequencer | Mitsubishi Q series |
| Recipe | 30 recipe x 50 step |
| Throughput / hr | 100~120 pcs base on heating time |
