Hot Plate

ELS604FA

觀看設備規格:

  • ELS604FA
Wafer Size 50mm ~ 100mm wafer
Layout Unit LD / Robot / Centering / HP / ULD
Robot Type Double arms with mapping system
Clean Class Class 100 with HEPA
HP Temp. 30 ~ 150°C (Option : max. 200°C)
Heating Method Contact / Proximity
System Control PC Base (Option : CIM function)
PLC Sequencer Mitsubishi Q series
Recipe 30 recipe x 50 step
Throughput / hr 100~120 pcs base on heating time

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