Wafer Size | 50mm ~ 100mm wafer |
Layout Unit | LD / Robot / Centering / HP / ULD |
Robot Type | Double arms with mapping system |
Clean Class | Class 100 with HEPA |
HP Temp. | 30 ~ 150°C (Option : max. 200°C) |
Heating Method | Contact / Proximity |
System Control | PC Base (Option : CIM function) |
PLC Sequencer | Mitsubishi Q series |
Recipe | 30 recipe x 50 step |
Throughput / hr | 100~120 pcs base on heating time |