Wafer Size: | 50mm ~ 300mm wafer |
LD/ULD: | 2 Cassette |
Robot: | Dual Arms |
Clean Class: | Class 100 with HEPA |
Soaking Tank: | 1 ~ 2 |
Chemical: |
Temperature Control System Recycle |
HPC Chamber: | 1 ~ 2 |
Spin Speed: | 30 ~ 4000 rpm |
High Pressure Nozzle: |
Stream / Spray / MCM® Type Pressure Control By Recipe |
Chemical: |
Temperature Control System Recycle / Fresh ( Programmable ) |
Top / Back Side Rinse: | Yes |
TCM Chamber: | 1 |
Nozzle: | TCM® Type ( Mixed DIW & N2 or CDA ) |
Top / Back Side Rinse: | Yes |
Cleaner Chamber: | 1 ~ 2 |
Nozzle: | Stream type |
Chemical: | IPA / DIW / ACE (option) |
Top / Back Side Rinse: | Yes |
CO2 Bubble System: | Yes |
Safety: | Automatic Fire Extinguishing System |
System Control: | PC |
PLC Sequencer: | Mitsubishi Q series |
Option: |
EFEM RFID Reader Hot DIW System Hot N2 System SECS/GEM |