| Wafer Size: | 50mm ~ 300mm wafer |
| LD/ULD: | 2 Cassette |
| Robot: | Dual Arms |
| Clean Class: | Class 100 with HEPA |
| Soaking Tank: | 1 ~ 2 |
| Chemical: |
Temperature Control System Recycle |
| HPC Chamber: | 1 ~ 2 |
| Spin Speed: | 30 ~ 4000 rpm |
| High Pressure Nozzle: |
Stream / Spray / MCM® Type Pressure Control By Recipe |
| Chemical: |
Temperature Control System Recycle / Fresh ( Programmable ) |
| Top / Back Side Rinse: | Yes |
| TCM Chamber: | 1 |
| Nozzle: | TCM® Type ( Mixed DIW & N2 or CDA ) |
| Top / Back Side Rinse: | Yes |
| Cleaner Chamber: | 1 ~ 2 |
| Nozzle: | Stream type |
| Chemical: | IPA / DIW / ACE (option) |
| Top / Back Side Rinse: | Yes |
| CO2 Bubble System: | Yes |
| Safety: | Automatic Fire Extinguishing System |
| System Control: | PC |
| PLC Sequencer: | Mitsubishi Q series |
| Option: |
EFEM RFID Reader Hot DIW System Hot N2 System SECS/GEM |