Spin Developer

ELS7606FA

觀看設備規格:

  • ELS7606FA
Wafer Size: 100mm~150mm wafer
Layout Unit LD / Robot / Centering / Developer / HP / CP / ULD
Robot Type Double arms with mapping system
Clean Class Class 100 with HEPA
Spin Speed 30 ~ 5000 rpm
Acceleration 8000rpm / sec.
Developer Dispense Method : Pump with nozzle scan ability
(Option : Developer Temperature Control System)
DIW Rinse / N2 Dry Nozzle YES
HP Temp.  30 ~ 150°C (Option : max. 200°C)
Heating Method Contact / Proximity
System Control PC Base 
(Option : CIM function)
PLC Sequencer Mitsubishi Q series
Recipe 30 recipe x 50 step
Throughput / hr 90 ~ 120 pcs based on developer recipe

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