Wafer Size: | 100mm~150mm wafer |
Layout Unit: | LD / Robot / Centering / Developer / HP / CP / ULD |
Robot Type: | Double arms with mapping system |
Clean Class: | Class 100 with HEPA |
Spin Speed: | 30 ~ 5000 rpm |
Acceleration: | 8000rpm / sec. |
Developer Dispense Method : |
Pump with nozzle scan ability (Option : Developer Temperature Control System) |
DIW Rinse / N2 Dry Nozzle: | YES |
HP Temp. : | 30 ~ 150°C (Option : max. 200°C) |
Heating Method: | Contact / Proximity |
System Control: |
PC Base (Option : CIM function) |
PLC Sequencer: | Mitsubishi Q series |
Recipe: | 30 recipe x 50 step |
Throughput / hr: | 90 ~ 120 pcs based on developer recipe |