| Wafer Size: | 100mm ~ 150mm wafer |
| Layout Unit: | LD / Robot / Centering / Clean Chamber / ULD |
| Robot Type: | Double arms with mapping system |
| Clean Class: | Class 100 with HEPA |
| Spin Speed: | 30 ~ 5000 rpm |
| Clean Chamber: | Spray Nozzle, Brush and N2 blow |
| System Control: |
PC Base (Option : CIM function) |
| PLC Sequencer: | Mitsubishi Q series |
| Recipe: | 30 recipe x 50 step |
| Throughput / hr: | 90 pcs based on recipe |
| Performance: |
1. Dry in Dry out 2. Particle Remove Rate > 98% (Production yield rate increase > 1%) |