Wafer Size: | 150m ~ 200mm wafer |
Layout Unit: | LD / Robot / Centering / Clean Chamber / ULD |
Robot Type: | Double arms with mapping system |
Clean Class: | Class 100 with HEPA |
Spin Speed: | 30 ~ 5000 rpm |
Clean Chamber: | Spray Nozzle, Brush and N2 blow |
System Control: |
PC Base (Option : CIM function) |
PLC Sequencer: | Mitsubishi Q series |
Recipe: | 30 recipe x 50 step |
Throughput / hr: | 90 pcs based on recipe |
Performance: |
1. Dry in Dry out 2. Particle Remove Rate > 98% (Production yield rate increase > 1%) |