Spin Cleaner (Scrubber)

ELS508FA

觀看設備規格:

  • ELS508FA
Wafer Size: 150m ~ 200mm wafer
Layout Unit: LD / Robot / Centering / Clean Chamber / ULD
Robot Type Double arms with mapping system
Clean Class: Class 100 with HEPA
Spin Speed: 30 ~ 5000 rpm
Clean Chamber Spray Nozzle, Brush and N2 blow
System Control PC Base
(Option : CIM function)
PLC Sequencer Mitsubishi Q series
Recipe 30 recipe x 50 step
Throughput / hr 90 pcs based on recipe
Performance 1. Dry in Dry out
2. Particle Remove Rate > 98%
(Production yield rate increase > 1%)

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