Work Size: | ψ150mm ~ 200mm wafer |
Mask Size: | □7" & □ 9" Quartz or Soda Lime |
Lamp House Watt: | 660W ~ 940W |
Wavelength Range: |
Broad Band ( i line : 365nm / h line : 400nm / g line : 436 nm ) |
Light Intensity: | > 20 mW / cm2 based on 365 nm |
Lamp Source: | UV Mercury Lamp |
Light Intensity Uniformity: | < 3% based on Dia. 8" wafer |
Effective Exposure Area: | Max. 200 mm x 200 mm |
Robot Type: | Double arms with mapping system |
Exposure Mode: |
Proximity / Soft Contact / Hard Contact / Vacuum Contact |
Alignment Key: | 150 μm x 150μm And Smaller |
Alignment Accuracy: |
±2μm for top side alignment ±3μm for bottom side alignment |
L/S Resolution: | 1μm based on contact mode and PR thickness 1μm |
Tact time: |
Top side : < 40 sec./pc Bottom side : < 45 sec./pc |
System Control: | PC Base |
Option: |
Cut Filter DUV Lamp House 積算光量功能 Power Meter |
ELS Model No.: | ELS108FA-B |
Work Size: | ψ150mm ~ 200mm wafer |
Mask Size: | □7" & □ 9" Quartz or Soda Lime |
Lamp House Watt: | 660W ~ 940W |
Wavelength Range: |
Broad Band ( i line : 365nm / h line : 400nm / g line : 436 nm ) |
Light Intensity: | > 20 mW / cm2 based on 365 nm |
Lamp Source: | UV Mercury Lamp |
Light Intensity Uniformity: | < 3% based on Dia. 8" wafer |
Effective Exposure Area: | Max. 200 mm x 200 mm |
Robot Type: | Double arms with mapping system |
Exposure Mode: |
Proximity / Soft Contact / Hard Contact / Vacuum Contact |
Alignment Key: | 150 μm x 150μm And Smaller |
Alignment Accuracy: | ±2μm |
L/S Resolution: | 1μm based on contact mode and PR thickness 1μm |
Tact time: | < 40 sec./pc |
System Control: | PC Base |
Option: |
Cut Filter DUV Lamp House 積算光量功能 Power Meter |
ELS Model No.: | ELS108FA |