| Wafer Size: |
ψ50mm ~ 150mm wafer Max. □100mm x 100mm substrate |
| Spin Speed: | 100 ~ 7500 rpm |
| Spin Speed Accuracy: | ± 1% |
| Sequencer: | Mitsubishi Series |
| Recipe: | 15 recipe x 24 step |
| Work Fixture: | By Vacuum |
| Stage Material: |
Al Option: Teflon |
| System Control: | PLC |
| PR coating uniformity: | ± 3% |
| Option: |
PR Dispense System Chuck for Broken wafer |