Wafer Size: |
ψ50mm ~ 150mm wafer Max. □100mm x 100mm substrate |
Spin Speed: | 100 ~ 7500 rpm |
Spin Speed Accuracy: | ± 1% |
Sequencer: | Mitsubishi Series |
Recipe: | 15 recipe x 24 step |
Work Fixture: | By Vacuum |
Stage Material: |
Al Option: Teflon |
System Control: | PLC |
PR coating uniformity: | ± 3% |
Option: |
PR Dispense System Chuck for Broken wafer |