Wafer Size: | 100mm ~ 150mm wafer |
Layout Unit: | LD / Robot / Centering / Coater / HP / CP / ULD |
Robot Type: |
Double arms with mapping system |
Clean Class: | Class 100 with HEPA |
Spin Speed: | 50 ~ 7000 rpm |
Acceleration: | 10000 rpm / sec. |
PR Dispense Method: |
Pump (< 100 cp) |
Edge / Back Side Rinse: | YES |
HP Temp: | 30 ~ 150°C |
Heating Method: | Contact / Proximity |
System Control: | PC Base (Option : CIM function available) |
PLC Sequencer: | Mitsubishi Q series |
Recipe: | 30 recipe x 50 step |
Throughput / hr: | 100 ~ 120 pcs based on PR coating recipe |
Model No. : | ELS3606FA |
Wafer Size: | 50mm ~ 100mm wafer |
Layout Unit: | LD / Robot / Centering / Coater / HP / CP / ULD |
Robot Type: |
Double arms with mapping system |
Clean Class: | Class 100 with HEPA |
Spin Speed: | 50 ~ 7000 rpm |
Acceleration: | 10000 rpm / sec. |
PR Dispense Method: |
Pump (< 100 cp) |
Edge / Back Side Rinse: | YES |
HP Temp: | 30 ~ 150°C |
Heating Method: | Contact / Proximity |
System Control: | PC Base (Option : CIM function available) |
PLC Sequencer: | Mitsubishi Q series |
Recipe: | 30 recipe x 50 step |
Throughput / hr: | 100 ~ 120 pcs based on PR coating recipe |
Model No. : | ELS3604FA |