| Wafer Size: | 100mm ~ 150mm wafer |
| Layout Unit: | LD / Robot / Centering / Coater / HP / CP / ULD |
| Robot Type: |
Double arms with mapping system |
| Clean Class: | Class 100 with HEPA |
| Spin Speed: | 50 ~ 7000 rpm |
| Acceleration: | 10000 rpm / sec. |
| PR Dispense Method: |
Pump (< 100 cp) |
| Edge / Back Side Rinse: | YES |
| HP Temp: | 30 ~ 150°C |
| Heating Method: | Contact / Proximity |
| System Control: | PC Base (Option : CIM function available) |
| PLC Sequencer: | Mitsubishi Q series |
| Recipe: | 30 recipe x 50 step |
| Throughput / hr: | 100 ~ 120 pcs based on PR coating recipe |
| Model No. : | ELS3606FA |
| Wafer Size: | 50mm ~ 100mm wafer |
| Layout Unit: | LD / Robot / Centering / Coater / HP / CP / ULD |
| Robot Type: |
Double arms with mapping system |
| Clean Class: | Class 100 with HEPA |
| Spin Speed: | 50 ~ 7000 rpm |
| Acceleration: | 10000 rpm / sec. |
| PR Dispense Method: |
Pump (< 100 cp) |
| Edge / Back Side Rinse: | YES |
| HP Temp: | 30 ~ 150°C |
| Heating Method: | Contact / Proximity |
| System Control: | PC Base (Option : CIM function available) |
| PLC Sequencer: | Mitsubishi Q series |
| Recipe: | 30 recipe x 50 step |
| Throughput / hr: | 100 ~ 120 pcs based on PR coating recipe |
| Model No. : | ELS3604FA |