Work Size: | ψ200mm~300mm wafer |
Mask Size: | □9" or □14" Quartz or Soda Lime |
Lamp House: | 1.89 KW |
Wavelength Range: |
Broad Band ( i line : 365nm / h line : 400nm / g line : 436 nm) |
Light Intensity: | > 15 mW / cm2 based on 365 nm |
Light Intensity Uniformity: | < 5% based on Dia. 12" wafer |
Effective Exposure Area: | Max. □300 mm x 300 mm |
Compensation Leveling System Driven: |
By Auto |
Contact Driven: | By Auto |
Exposure Mode: | Proximity / Soft Contact / Hard Contact |
Alignment System: | By CCD driven by manual method |
Alignment Accuracy: | ±3μm ( 12" ) |
L/S Resolution: | 3μm based on contact Mode and PR thickness 1μm |
Anti-vibration Table: | Yes |
System Control: | PC Base |
Option: |
Cut Filter DUV Lamp House Chuck for Broken wafer 積算光量功能 Power Meter Bottom Side Alignment System |