| Wafer Size: | 150mm ~ 200mm wafer |
| Layout Unit: | LD / Robot / Centering / Developer / HP / CP / ULD |
| Robot Type: |
Double arms with mapping system (Option : Auto Load Port System) |
| Clean Class: | Class 100 with HEPA |
| Spin Speed: | 30 ~ 5000 rpm |
| Acceleration: | 8000rpm / sec. |
| Developer Dispense Method : |
Pump with nozzle scan ability (Option : Developer Temperature Control System) |
| DIW Rinse / N2 Dry Nozzle: | YES |
| HP Temp. : | 30 ~ 150°C (Option : max. 200°C) |
| Heating Method: | Contact / Proximity |
| System Control: |
PC Base (Option : CIM / SECS+GEM Available) |
| PLC Sequencer: | Mitsubishi Q series |
| Recipe: | 30 recipe x 50 step |
| Throughput / hr: | 90 ~ 120 pcs based on developer recipe |