Spin Developer
ELS708SA
觀看設備規格：
- ELS708SA
| Work Size： |
ψ50mm~200mm wafer Max. □150mm x 150mm substrate |
| Spin Speed： | 100 ~ 4500 rpm |
| Spin Speed Accuracy： | ±1% |
| Acceleration： | 3000rpm / Sec. |
| Developer Nozzle： | 1 ~ 3 System |
| DIW Nozzle： | 1 System |
| Back Side Rinse： | Yes |
| Recipe： | 20 Recipes x 40 Steps |
| Work Fixture： | By Vacuum |
| Stage Material： |
Al Option: Teflon |
| System Control： | PLC |
| Option： |
Developer Temp. Control System N2 Dry nozzle |
