Wafer Size: | 200mm ~ 300mm wafer |
Layout Unit: | Auto Load port / Robot + Track / Centering / Coater / HP / CP / ULD |
Robot Type: | Double arms with mapping system |
Clean Class: | Class 100 with HEPA |
Spin Speed: | 30 ~ 5000 rpm |
Acceleration: | 8000 rpm / sec. |
PR Dispense Method: |
N2 Pressure Tank or Pump (Option: PR Pump for High Viscosity up to 10,000 cps) |
Edge / Back Side Rinse: | YES |
HP Temp: | 30 ~ 200°C |
Heating Method: | Contact / Proximity |
System Control: | PC Base (Option : SECS+GEM available ) |
PLC Sequencer: | Mitsubishi Q series |
Recipe: | 30 recipes x 50 steps |
Throughput / hr: | Up to 50pcs based on Thick PR recipe |