Wafer Size: | 150mm ~ 200mm wafer |
Layout Unit: |
LD / Robot / Centering / Soaking system / Stripping system / Cleaning / ULD |
Robot Type: | Double arms with mapping system |
Clean Class: | Class 100 with HEPA |
Spin Speed: | 30 ~ 5000 rpm |
Soaking System: | Stripper Chemical Temp. 80℃ |
Stripping System: |
With patented TCM Nozzle® Scan Speed Flexible |
System Control: |
PC Base (Option : CIM & SECS / GEM function) |
PLC Sequencer: | Mitsubishi Q series |
Recipe: | 30 recipe x 50 step |
Throughput / hr: | 35 pcs based on recipe |
Performance: |
1. Dry in Dry out 2. One Station for Metal Lift-off & PR Remove 3. Metal (Au) Recovery Rate > 90% 4. Stripper Chemical cost down > 50% (compare with Wet Bench Type) |